mpx2050 rev 9, 10/2008 freescale semiconductor ? freescale semiconductor, inc., 2002, 2008. all rights reserved. pressure + 50 kpa on-chip temperature compensated and calibrated silicon pressure sensors the mpx2050 series devices are silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output, directly proportional to the applied pressure. the sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. the chip is laser trimmed for precise span and offset ca libration and temperature compensation. features ? temperature compensated over 0 c to +85 c ? unique silicon shear stress strain gauge ? easy to use chip carrier package options ? ratiometric to supply voltage ? differential and gauge options ? 0.25% linearity ordering information device name package options case no. # of ports pressure type device marking none single dual gauge differential absolute unibody package (mpx2050 series) mpx2050d tray 344 ? ? mpx2050d mpx2050gp tray 344b ? ? mpx2050gp MPX2050DP tray 344c ? ? MPX2050DP mpx2050gsx tray 344f ? ? mpx2050d mpx2050 series 0 to 50 kpa (0 to 7.25 psi) 40 mv full scale span (typical) packages mpx2050d case 344-15 mpx2050gp case 344b-01 MPX2050DP case 344c-01 mpx2050gsx case 344f-01 application examples ? pump/motor controllers ? robotics ? level indicators ? medical diagnostics ? pressure switching ? non-invasive blood pressure
mpx2050 sensors 2 freescale semiconductor pressure figure 1 shows a block diagram of the internal circ uitry on the stand-alone pressure sensor chip. figure 1. temperature compensated pressure sensor schematic voltage output versus applied differential pressure the differential voltage output of the sensor is directly proportional to the differential pressure applied. the output voltage of the diff erential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacuum side (p2). similarly, output voltage increases as increasing vacuum is applied to the vacuum side (p2) relative to the pressure side (p1). v s 3 sensing element thin film temperature compensation and calibration circuitry 2 4 +v out -v out 1 gnd
mpx2050 sensors freescale semiconductor 3 pressure operating characteristics table 1. operating characteristics (v s = 10 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristics symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0 ? 50 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. operating the device above th e specified excitation range may i nduce additional error due to device self-heating. v s ? 10 16 vdc supply current i o ? 6.0 ? madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fss 38.5 40 41.5 mv offset (4) 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off -1.0 ? 1.0 mv sensitivity v/ p? 0.8 ?mv/kpa linearity (5) 5. accuracy (error budget) c onsists of the following: linearity:output deviation from a straight line relationship wi th pressure, using end point met hod, over the specified pressure range. temperature hysteresis:output deviation at any temperature within the operating temperature range, after the temperature is cyc led to and from the minimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis:output deviati on at any pressure within the specified range, wh en this pressure is cycled to and from the m inimum or maximum rated pressure, at 25 c. tcspan:output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. tcoffset:output deviation with mini mum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? -0.25 ? 0.25 %v fss pressure hysteresis (5) (0 to 50 kpa) ?? 0.1 ? %v fss temperature hysteresis (5) (-40 c to +125 c) ?? 0.5 ? %v fss temperature effect on full scale span (5) tcv fss -1.0 - 1.0 %v fss temperature effect on offset (5) tcv off -1.0 - 1.0 mv input impedance z in 1000 - 2500 output impedance z out 1400 - 3000 response time (6) (10% to 90%) 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ? 1.0 ? ms warm-up ?? 20 ? ms offset stability (7) 7. offset stability is the product's output deviation when subjec ted to 1000 hours of pulsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
mpx2050 sensors 4 freescale semiconductor pressure maximum ratings linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 2 ) or (2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (l ower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightfo rward for the user. motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. linearity specification comparison table 2. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damag e or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 200 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c relative voltage output pressure (% fullscale) 0 50 100 end point straight line fit exaggerated performance curve least squares fit least square deviation straight line deviation offset
mpx2050 sensors freescale semiconductor 5 pressure on-chip temperature comp ensation and calibration figure 3 shows the minimum, maxi mum and typical output characteristics of the mpx2050 series at 25 c. the output is directly proportional to the differential pressure and is essentially a straight line. the effects of temperature on full-scale span and offset are very small and are shown under operating characteristics. figure 3. output versus pressure differential figure 4. cross-sectional diagram (not to scale) figure 4 illustrates the differential or gauge configuration in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the mpx2050 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long term reliabi lity. contact the factory for information regarding media compatibility in your application. output (mvdc) kpa psi 40 35 30 25 15 10 5 0 -5 0 12.5 1.8 25 3.6 37.5 5.4 50 7.25 offset (typ) 20 max typ min v s = 10 vdc t a = 25 c mpx2050 p1 > p2 span range (typ) silicone die coat wire bond lead frame die stainless steel metal cover epoxy case rtv die bond p1 p2
mpx2050 sensors 6 freescale semiconductor pressure pressure (p1)/vacuum (p2) side identification table freescale designates the two si des of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing the silicone gel which isolates the die. the pressure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the following table. table 3. pressure (p1) side delineation part number case type pressure (p1) side identifier mpx2050d 344 stainless steel cap MPX2050DP 344c side with part marking mpx2050gp 344b side with port attached mpx2050gsx 344f side with port attached
mpx2050 sensors freescale semiconductor 7 pressure package dimensions notes: 1. 2. 3. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). m a m 0.136 (0.005) t 1234 pin 1 r n l g f d 4 pl seating plane -t- c m j b -a- dambar trim zone: f this is included within dim. "f" 8 pl 1 23 4 y z style 1: pin 1. ground 2. + output 3. + supply 4. - output style 2: pin 1. v cc 2. - supply 3. + supply 4. ground style 3: pin 1. gnd 2. -vout 3. vs 4. +vout dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30? nom 30? nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 y 0.048 0.052 1.22 1.32 z 0.106 0.118 2.68 3.00 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. d 4 pl f u h l port #1 positive pressure (p1) pin 1 -a- -q- s k g -p- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 seating plane b n r c j -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10 case 344b-01 issue b unibody package case 344-15 issue aa unibody package
mpx2050 sensors 8 freescale semiconductor pressure package dimensions notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. port #2 port #1 port #2 vacuum (p2) (p1) seating plane seating plane k s w h l u f g d 4 pl port #1 positive pressure -q- 12 4 3 pin 1 -p- -t- -t- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t b n j c v r -a- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.248 0.278 6.30 7.06 w 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. e c j v -t- port #1 positive pressure (p1) pin 1 4 pl d -p- g k m q m 0.25 (0.010) t u a f s n b s p m 0.13 (0.005) q s t -q- r 4321 dim min max min max millimeters inches a 1.080 1.120 27.43 28.45 b 0.740 0.760 18.80 19.30 c 0.630 0.650 16.00 16.51 d 0.016 0.020 0.41 0.51 e 0.160 0.180 4.06 4.57 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k n 0.070 0.080 1.78 2.03 p 0.150 0.160 3.81 4.06 q 0.150 0.160 3.81 4.06 r 0.440 0.460 11.18 11.68 s 0.695 0.725 17.65 18.42 u 0.840 0.860 21.34 21.84 v 0.182 0.194 4.62 4.92 0.220 0.240 5.59 6.10 style 1: pin 1. ground 2. v (+) out 3. v supply 4. v (-) out case 344f-01 issue b unibody package case 344c-01 issue b unibody package
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